Advantech launches new industrial-grade fanless Thin Mini-ITX motherboard
Advantech announces the release of AIMB-217, a new industrial-grade fanless Thin Mini-ITX motherboard. With the latest Intel Pentium, Celeron, and Atom N4200/N3350/x7-E3950 processors (formerly Apollo Lake processor), AIMB-217 provides 30 percent CPU performance enhancement and 45 percent graphic performance boost compared with previous generations. It comes bundled with Advantech's exclusive WISE-PaaS/RMM software suite for remote device management. AIMB-217 offers significant graphics performance boost up to 4K2K with a low power CPU TDP of 6~12 W only. AIMB-217 also supports extended operating temperatures of -20 to 70 degrees Celsius, which makes it suitable for semi-outdoor applications.
AIMB-217 adopts a rich array of I/O interface including: dual GbE LAN ports, 4 x USB 3.0, 8 x USB 2.0, 2 x SATAIII. For expansion, AIMB-217 supports 1 x PCIe x1, 1 x M.2 (E key), and 1 x full-size MiniPCIe (colay mSATA) w/SIM card holder for flexible modular add-on card installation. Moreover, AIMB-217 supports 6 x COM (COM3 supports RS-232/422/485 auto-flow control, COM 6 supports 5V/12V), which benefits users who want to connect devices without additional external power supplies and those needing reliable data transfers over long distances.
AIMB-217 integrates Intel Gen 9 graphics engine, with up to 18 EUs, which improves throughput and media acceleration, and 4K2K display resolution. With the new graphics core, AIMB-217 provides rich display interfaces such as VGA, DisplayPort1.2, HDMI1.4, LVDS, and eDP. It can support three simultaneous, independent display outputs, deliver stunning graphics and media performance (DirectX 12.0, OpenGL 4.3, OpenCL 2.0 Full Profile) and the 4096 x 2160 high resolution output satisfies the needs of high-quality display applications, which makes it ideal for gaming and digital signage customers who require a slim size solution with high resolution graphics and up to three independent display output.
AIMB-217Z will be available in Q1 2018.
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